- Publication date
- 16th December 2015
- Information type
- Policy area
This letter sets out our guidance to interconnector developers who are considering requests for variations(s) to the cap and floor regime related to financing. This guidance applies to both the projects which came through the first cap and floor application window as well projects that will be submitted through our second application window.
We are publishing this letter alongside a letter of support from the European Investment Bank (EIB) setting out that the bank intends to offer a range of financial products to support financing of interconnection to UK.